Multilayer PCBs
Your direct benefit: Manufacture according to standard parameters
- Time and cost savings through reduced design and work preparation workload
- Yield optimisation on both sides
- Clear and unambiguous communication
- Stable transition from prototype to series production
| Properties | Values |
|---|---|
| max. number of layers | 20 |
| max. circuit board size | 570 x 500 mm |
| circuit board thickness |
max. 2.4 mm* min. 0.6 mm |
| copper cladding (base copper) | 18 µm, 35 µm, 70 µm, 105 µm |
| material | FR4 (TG 135, TG 150, TG 170) |
| surface finishes |
HAL, HAL lead-free, electroless nickel/ immersion gold, immersion tin, immersion silver |
| min. tool diameter | 0.25 mm |
| min. conductor track width and distance |
100/100 µm (standard) 75 µm (min) |
| aspect ratio (hole diameter : circuit board thickness) | 1 : 8 |
| additional printing |
legend printing via fill print peelable resist |
| * greater thickness upon request |
| Dokumentation | Standard |
|---|---|
| Inspection certificate | According to DIN EN 10204 |
| Factory inspection certificate |
According to DIN EN 10204 Inspection according to IPC-A-6011 |
| Initial sample inspection “standard” |
According to DIN EN 10204 Inspection according to IPC-A-6011 |
| Initial sample inspection “thorough” |
According to DIN EN 10204 Inspection according to IPC-A-6011 |